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High Speed Printed Circuit Board Technology
Release time:
2024-12-08
High-speed printed circuit board (PCB) technology encompasses various advanced manufacturing processes, including High-Speed Material Study and Application, High Registration, Low Roughness Brown Oxidation, Backdrill, Impedance Control, and Insertion Loss Control. These technologies are widely applied in products such as servers, storage devices, switches, routers, and optical modules.
1.High-Speed Material Study and Application
By establishing a system for studying processing parameters of high-speed materials and evaluating their reliability and electrical performance, the optimal processing parameters for critical PCB processes can be determined. Test data on the reliability and electrical performance of high-speed materials is collected to ensure their inherent and stable performance during mass production. Standards for selecting high-speed materials are developed to provide customers with valuable suggestions for material selection.
2.High Registration
- Core Baking: Ensures better dimensional stability of the core before the image transfer process.
- Scale Value Factors: Provides matching scale factors based on the structure, dielectric thickness, copper thickness, copper coverage ratio, and prepreg composition on both sides of the core.
- Inner Layer Circuit: LDI (Laser Direct Imaging) exposure ensures alignment accuracy and stable scale value of the inner core layers.
- Lamination: Use the Pin-Lamination System or thermal welding on the four edges of the panel, combined with CCD post-etching rivet punching.
3.Backdrill Technology
Using a drilling machine with depth-controlled drilling capabilities to remove excess barrel copper in signal holes, controlling the stub length, and reducing conductor reflection loss caused by overly long stubs, thereby achieving better signal integrity.
4.Impedance Control
- Inner & Outer Layer Circuit: LDI exposure combined with vacuum etching ensures high-quality pattern accuracy and uniformity.
- Lamination: The use of hot-and-cold integrated presses ensures uniform dielectric thickness.
- Copper Plating: Apply pulse plating for high aspect ratio holes to achieve consistent copper thickness.
5. Insertion Loss Control
Perform simulation analysis of factors affecting insertion loss during PCB processing, combined with actual processing validation, to determine the processing tolerances for each influencing factor (e.g., copper surface roughness). Strict control is implemented during manufacturing to ensure the consistency of insertion loss.
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