Multilayer PCBs
Multilayer PCBs
Your reliable PCB solutions provider
The rise of multi-layer PCBs has resulted in a significant increase in their number. These are commonly utilized in various electronic equipment, such as 5G base stations, electric cars, servers, and power control systems. WTT can produce these types of PCBs in various capacities, ranging from small batches to massive production.
With a wide range of offerings, WTT Enterprise is a leading provider for the production of printed circuit boards. We are able to serve our customers by providing them with a variety of solutions that are designed to meet their varying needs. In conventional printed circuit boards, our prices are competitive and our quality is exceptional. Through our global capabilities and presence, we can offer our customers the necessary peace of mind.
Through our extensive knowledge and experience, we can provide our customers with an optimal solution that addresses their specific technical requirements. Our team of experts is also able to keep up with the latest technological changes in the industry.
What can we do？
We are able to offer a wide range of power PCBs. WTT is capable of producing copper boards that are up to 5 oz thickness. In addition, it can also perform various processes such as resin plug hole, metal half hole, and buried blind hole. The company's processing capabilities and production capacities have allowed it to offer its customers reliable and high-quality products.
Technical Characteristics
◆ Max. Aspect Ratio: Mass production 20:1;Sample 25:1
◆ Line Width/Space : Tight Tolerance Control
◆ Tight lmpedance Control Tolerance to ±8%
◆ Depth Control Routing and Backdrilling
◆ Resin Plug Hole POFV (Cover Hole Plating)
◆ High-frequency and High-speed: Insertion Loss Control and PIM Control
◆ Thermal Solution: Embedded Copper Coin,Metal Substrate (Aluminum Substrate,Copper Substrate), Thick Barrel Copper up to 75μm
◆ Heavy Copper Capability:Up to 5 oz. for Outer Layer; 5 oz. for Inner Layer
◆ Metallic Half Holes, Metallic Edges
◆ Material Selection:High Frequency, High Speed (Low Loss/Ultra-Low Loss/Extremely Low Loss), High Thermal Conductivity, Halogen-free
◆ Hybrid Lamination for Combination of FR4 with Low Loss Material
◆ Wide Range Selections for Solder Mask and Surface Finishes Type
Technical parameter
| No.. | Item | Unit | WTT Capability | ||
| Mass Production | Advanced NPI | ||||
| 1 | Max. Layer Count | L | 24 | 36 | |
| 2 | Max. Panel Size | mm (＂) | 620*710 (24.4*28.0) | 620*710 (24.4*28.0) | |
| 3 | Max. Board Thickness | mm (mil) | 4.5 (177) | 6.0 (236) | |
| 4 | Materials | / | FR4, Halogen-Free, Low Loss, High Frequency | ||
| 5 | Min. Dielectric Thickness | Core | µm (mil) | 50 (2.0) | 50 (2.0) |
| Prepreg | µm (mil) | 50 (2.0) | 40 (1.6) | ||
| 6 | Min. Drill Size | PTH- Mechanical | mm (mil) | 0.15 (6.0) | 0.10 (4.0) |
| PTH -Laser | µm (mil) | 75 (3.0) | 75 (3.0) | ||
| Blind Via - Laser | µm (mil) | 75 (3.0) | 75 (3.0) | ||
| 7 | Max. Aspect Ratio | PTH | / | 20:1 | 25:1 |
| 8 | Min. Annular Ring | Mechanical - Inner Layer | µm (mil) | 89 (3.5) | 89 (3.5) |
| Mechanical - Outer Layer | µm (mil) | 75 (3.0) | 75 (3.0) | ||
| 9 | Min. Drill to Copper (D2C) | µm (mil) | 150 (6.0) | 150 (6.0) | |
| 10 | Heavy Copper | Max. Copper Thickness | oz | 5 | 5 |
| Testing Capability | / | High Voltage 10000V, Inductance, VPP, Resistance, Surface Isolation |
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| 11 | Min. Line Width / Space | Inner Layer @ Toz Cu | µm (mil) | 35/40(1.4/1.6) | 30/40 (1.2/1.6) |
| Inner Layer @ Hoz Cu | µm (mil) | 40/50 (1.6/2.0) | 35/45 (1.4/1.8) | ||
| Inner Layer @ 1oz Cu | µm (mil) | 75/75 (3.0/3.0) | 70/70 (2.8/2.8) | ||
| Outer Layer @ 20µm Cu | µm (mil) | 50/50 (2.0/2.0) | 45/50 (1.8/2.0) | ||
| Outer Layer @ 40µm Cu | µm (mil) | 75/75 (3.0/3.0) | 70/70 (2.8/2.8) | ||
| 12 | Backdrill | Backdrill Stub Length | mm(mil) | 0.05~0.25(2~10) | 0.05~0.20(2~8) |
| Backdrill Hole Size | mm | D + 0.20 | D + 0.15 | ||
| 13 | POFV | Resin Plugging - PTH | mm | 0.15~0.80, 12:1 | 0.10~1.0, 15:1 |
| 14 | Impedance Tolerance | <50Ω | Ω | ±4.5 | ±4 |
| ≥50Ω | % | ±10 | ±8 | ||
| 15 | Surface Finish | Phase I: ENIG, Electroplated Gold, Gold Finger, Lead-free HASL, OSP. Phase II: Imm. Tin, Imm. Silver |
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