Insulated Metallic Substrate PCBs
Insulated Metallic Substrate PCBs
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A metal-based PCB, also known as a IMSPCB, is composed of a metal substrate, which is usually either copper or aluminum. Due to its superior thermal dissipation, it is commonly used in various applications such as power supplies and LED lights.
WTT Enterprise has extensive experience of producing IMS printed circuit boards, which are commonly used for powering electronic components such as power meters and LED lights. These are also known as heat sinks. The base material used for these PCBs is either copper or aluminum.
What can we do？
For over ten years, WTT Enterprise has been continuously working on the production of metal substrates. It is capable of producing both aluminum and copper substrates, which have a combined thermal conductivity of up to 100 percent.
Technical Characteristics
◆ Layer Count: 2-6 L
◆ Metal-Based Material Thickness ：0.5~3.2mm (20~126mil)
◆ Heavy Copper for Inner/Outer Layer: 5oz
◆ DHS capability on Aluminum Base is 0.6mm min.
◆ DHS capability on Copper Base is 0.6mm min.
◆ White or black solder mask available
◆ Highest breakdown power voltage: 5000V/AC
◆ Heat Dissipation result: 10W/m.K Max.
◆ Thermal conductivity: 1~10 W/（m•K）
◆ Several Metal Base Materials: Aluminum, Copper, Stainless Steel & Iron
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| No. | Item | MP Capability | Advanced Capability | ||
| 1 | Panel Size | Multilayer | 468*620mm (18.4*24.4") | 544*620mm (21.4*24.4") | |
| 2 | Max. Layer | Max Layer Count | 2L | 6L | |
| 3 | Metal-Based Material | Metal-Based Material Type | Al-Based, Cu-Based | Al-Based, Cu-Based | |
| Metal-Based Material Thickness | 0.8~2.0mm (31~79mil) | 0.5~3.2mm (20~126mil) | |||
| Max. Copper Thickness | 4oz | 5oz | |||
| Min. Dielectric Thickness | 75, 100, 125μm (3, 4, 5mil) | 50, 75~150μm (2, 3~6mil) | |||
| Thermal Conductivity | 0.8~3.0W/m·K | 0.8~3.0W/m·K | |||
| Electric Strength | 30kV/mm | 40kV/mm | |||
| 4 | Drilling | Min. Hole Size | Mechanical | 0.8mm (31mil) | 0.6mm (24mil) |
| Punching | 1.2mm (47mil) | 1.0mm (39mil) | |||
| Hole Size Tolerance | PTH | ±0.075mm (±3mil) | ±0.050mm (±2mil) | ||
| NPTH | ±0.050mm (±2mil) | ±0.030mm (±1.2mil) | |||
| Hole Position | ±0.080mm (±3.1mil) | ±0.050mm (±2mil) | |||
| Min. D2D (HW-HW) | 0.5~1.6mm Holes | 0.15mm (6mil) | 0.10mm (4mil) | ||
| 1.61~6.5mm Holes | 0.15mm (6mil) | 0.13mm (5mil) | |||
| Min. D2C (Drill to Cu) | PTH | 0.20mm (8mil) | 0.13mm (5mil) | ||
| NPTH | 0.18mm (7mil) | 0.10mm (4mil) | |||
| 5 | Trace | Registration | ±0.10m (4mil) | ±0.08m (3.1mil) | |
| 6 | V-Cut | V-Cut Board Thickness | ≥0.9mm | ≥0.6mm | |
| V-Cut Remain Board Thickness | 1/3 of Board Thickness | 1/3 of Board Thickness | |||
| V-Cut to Trace | ≥0.45mm (18mil) | ≥0.38mm (15mil) | |||
| V-Cut to Groove | ≥20mm | ≥10mm | |||
| V-Cut Width | ≤0.50mm | ≤0.38mm | |||
| 7 | Dimension Tolerance | V-Cut | ±0.13mm (±5mil) | ±0.10mm (±4mil) | |
| Outline | ±0.13mm (±5mil) | ±0.10mm (±4mil) | |||
| Conductors to Outline | ±0.15mm (±6mil) | ±0.13mm (±5mil) | |||
| Warp & Twist | 0.75% Max. | 0.50% Max. | |||
| 8 | Test | Voltage | 1500~2250VDC | 5000VDC Max. | |
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